ETCHING LIQUID, ETCHING METHOD, AND METHOD OF MANUFACTURING SOLDER BUMP
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United States of America Patent
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Issued Date -
Jul 9, 2015
app pub date -
Jan 5, 2015
filing date -
Jan 8, 2014
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
An etching Liquid which can selectively remove only a copper layer in an etching process of a multilayer structure including a cobalt layer and the copper layer is disclosed. The etching liquid is an etching liquid for etching the copper layer in the multilayer structure including the copper layer and the cobalt layer. This etching liquid includes at least one acid selected from a group consisting of citric acid, oxalic acid, malic acid, and malonic acid, and hydrogen peroxide, the etching liquid having pH in a range of 4.3 to 5.5.
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