METHOD OF MANUFACTURING CONDUCTIVE FILM AND COMPOSITION FOR FORMING CONDUCTIVE FILM
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United States of America Patent
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Mar 23, 2015
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Sep 26, 2012
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Abstract
A conductive film manufacturing method includes a coating formation step of forming a coating by applying onto a thermoplastic resin substrate a conductive film-forming composition including copper oxide particles (A), copper particles (B), and an organic polymer (C), a ratio of a copper particle (B) content to a copper oxide particle (A) content as expressed by B/A being 10 to 50 wt %, and a reduction step of reducing the copper oxide particles (A) through irradiation of the coating with pulsed light, thereby forming a copper-containing conductive film. The conductive film obtained by irradiation with pulsed light according to this method has good adhesion to the thermoplastic resin substrate.
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