Systems and methods for coupling a semiconductor device of an automation device to a heat sink

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United States of America Patent

PATENT NO 9570374
APP PUB NO 20150194367A1
SERIAL NO

14147285

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A system includes a heat sink, a semiconductor device, and a layer of thermal interface material (TIM) disposed between the heat sink and the semiconductor device. The TIM may facilitate dissipation of heat generated by the semiconductor device via the heat sink. The system also includes a fastener system that couples the semiconductor device to the heat sink about the layer of TIM. The system also includes one or more washers of the fastener system that maintain a coupling force between the semiconductor device and the heat sink after the TIM flows.

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Patent Owner(s)

  • ROCKWELL AUTOMATION TECHNOLOGIES, INC.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Bronk, Kelly James Kewaskum, US 2 6
Grosskreuz, Paul Jerome West Bend, US 3 8
Kopiness, Jeremiah John Saukville, US 3 7
Zhou, Rui West Bend, US 158 671

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