Flip chip pad geometry for an IC package substrate

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United States of America Patent

PATENT NO 9373576
APP PUB NO 20150194378A1
SERIAL NO

14151506

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Abstract

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An integrated circuit (IC) package substrate is provided. In one embodiment, the IC package substrate includes a dielectric layer having first and second opposing surfaces and a matrix of pillars disposed in the dielectric layer and arranged to receive a matrix of conductive elements of an IC die. Each pillar of the matrix of pillars is exposed at the first surface of the dielectric layer. Each pillar of the matrix of pillars extends through the dielectric layer to contact a metal layer attached to the second surface of the dielectric layer.

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Patent Owner(s)

Patent OwnerAddress
AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE LIMITED1 YISHUN AVENUE 7 SINGAPORE 768923

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Tsang, Kwok Cheung Irvine, US 26 1536

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