THERMALLY CONDUCTIVE ENCAPSULATE AND SOLAR CELL MODULE COMPRISING THE SAME
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United States of America Patent
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Issued Date -
Jul 9, 2015
app pub date -
Jan 8, 2014
filing date -
Jan 8, 2014
priority date (Note) -
Abandoned
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Abstract
A thermally conductive encapsulate comprising a thermally conductive composite layer having a thermal conductivity of 0.5 W/m*K to 8 W/m*K and an adhesive resin layer having a thermal conductivity of 0.05 W/m*K to 0.4 W/m*K is provided. A percentage of a thickness of the adhesive resin layer relative to a total thickness of the thermally conductive encapsulate ranges from 0.1% to 10%, and the thermally conductive encapsulate has an overall thermal impedance less than 0.72° C.-in2/W. Accordingly, the thermally conductive encapsulate not only provides sealing, insulating and adhesive properties, but also effectively dissipates the heat to the environment without increasing the thickness or volume of the solar cell module and without modifying the original encapsulation process, and thereby enhancing the solar cell module's conversion efficiency and increasing its power output.
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