METHOD FOR MANUFACTURING WIRING BOARD
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United States of America Patent
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Issued Date -
Jul 9, 2015
app pub date -
Dec 15, 2014
filing date -
Jan 9, 2014
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A method for manufacturing a wiring board includes steps of forming a groove portion in an outer periphery portion of a support metal foil provided metal foil in a shape of frame, in which a metal foil is held on the support metal foil with a release layer interposed between them, mounting the support metal foil provided metal foil on a principal surface of a support board containing an uncured thermosetting resin, pressing and heating them, forming a laminated body on an upper surface of the metal foil located at least in an inside region of the groove portion, cutting out the laminated body and the support board located in the inside region, and separating the laminated body from the support metal foil.
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