POLISH APPARATUS AND POLISH METHOD

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United States of America Patent

APP PUB NO 20150196988A1
SERIAL NO

14301713

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Abstract

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A polish apparatus including a polish pad including a polish surface configured to contact a polish object; and a coolant injector configured to inject a coolant to the polish surface and cool the polish pad by a vaporization heat.

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Patent Owner(s)

Patent OwnerAddress
TOSHIBA MEMORY CORPORATIONMINATO-KU TOKYO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
WATANABE, Takashi Yokkaichi, JP 821 8789

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