FORMING CONDUCTIVE PATTERN USING TITANIA SOL-GEL
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United States of America Patent
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Issued Date -
Jul 16, 2015
app pub date -
Jan 13, 2014
filing date -
Jan 13, 2014
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Abandoned
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Abstract
A conductive metal pattern is formed using a layer of a titania sol-gel formed from a titania precursor composition of (a) a titanium alkoxide or titanium aryloxide, (b) R(O)mCOCH2CO(O)nR′ wherein R and R′ are independently alkyl having at least 1 carbon atom, and m and n are independently 0 or 1, (c) water, (d) either an acid having a pKa less than 1 or a source of a halogen, and (e) a water-miscible organic solvent, on a substrate, to form a layer of a titania sol-gel on the substrate. The layer is contacted with electroless seed metal ions to provide a layer of electroless seed metal ions, imagewise exposed to form non-exposed regions and exposed regions. The electroless seed metal ions in the non-exposed regions are removed and the electroless seed metal nuclei within the titania sol-gel in the exposed regions are then electrolessly plated with a conductive metal.
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