Method for Plating Fine Grain Copper Deposit on Metal Substrate
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United States of America Patent
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Issued Date -
Jul 16, 2015
app pub date -
Jan 9, 2015
filing date -
Jan 15, 2014
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Abandoned
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Abstract
A method of depositing an oxygen-free electronic copper layer on a metal substrate is provided that includes cleaning a substrate surface, electropolishing the substrate surface activating the substrate surface, depositing nickel on the substrate; and depositing copper on the substrate using a cyanide copper strike bath and a cyanide copper plate bath, where a periodic pulse and a reverse periodic pulse current is applied using a pulse periodic reverse current power supply, where the deposited oxygen-free copper comprises a fine-grained, equiaxed structure having a uniform surface geometry and less than 10% thickness variation across all surfaces.
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