SEMICONDUCTOR MANUFACTURING APPARATUS AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
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United States of America Patent
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Issued Date -
Jul 16, 2015
app pub date -
Jun 6, 2014
filing date -
Jan 15, 2014
priority date (Note) -
Abandoned
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Abstract
A semiconductor manufacturing apparatus includes a chamber configured to house a semiconductor substrate therein. A vacuum part depressurizes inside of the chamber. A heater heats the semiconductor substrate. The vacuum part depressurizes the inside of the chamber in order to freeze water attached to the semiconductor substrate. The heater heats the semiconductor substrate in order to sublimate water frozen on the semiconductor substrate.
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