Stacked Heatsink Assembly
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United States of America Patent
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N/A
Issued Date -
Jul 16, 2015
app pub date -
Jan 16, 2015
filing date -
Jan 16, 2014
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A stacked heatsink comprises a first thermally conductive plate and a second thermally conductive plate. The first thermally conductive plate defines one or more recesses. The first and second thermally conductive plates each have first and second surfaces. The first thermally conductive plate second surface is configured in thermally conductive contact with the second thermally conductive plate first surface. The one or more recesses are configured to accommodate electronic components mounted to a surface of a printed circuit board to which the heatsink will be secured.
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