Wiring board and method of manufacturing the same

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United States of America Patent

PATENT NO 9913367
SERIAL NO

14585657

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Abstract

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A wiring board of an embodiment includes a through via, a first insulating film disposed around the through via, a second insulating film disposed around the first insulating film, a third insulating film disposed around the second insulating film and a resin disposed around the third insulating film. The resin includes fillers. The second insulating film has a relative permittivity lower than a relative permittivity of the first insulating film. The third insulating film has a relative permittivity higher than a relative permittivity of the second insulating film.

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Patent Owner(s)

  • KABUSHIKI KAISHA TOSHIBA

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Iida, Atsuko Yokohama, JP 45 262
Managaki, Nobuto Kawasaki, JP 20 56
Onozuka, Yutaka Yokohama, JP 45 494
Sasaki, Tadahiro Nerima, JP 32 224
Yamada, Hiroshi Yokohama, JP 691 7936

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