HIGH-DENSITY INTER-PACKAGE CONNECTIONS FOR ULTRA-THIN PACKAGE-ON-PACKAGE STRUCTURES, AND PROCESSES OF FORMING SAME
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United States of America Patent
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app pub date -
Mar 23, 2015
filing date -
Dec 16, 2009
priority date (Note) -
Abandoned
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Abstract
An apparatus includes a coreless mounting substrate and an interposer disposed on the coreless mounting substrate with a chip disposed in a recess in the interposer and upon the coreless substrate. The apparatus may include an inter-package solder bump in contact with an interconnect channel in the interposer, and a top chip package including a top package substrate and a top die disposed on the top package substrate. The top package substrate is in contact with the inter-package solder bump.
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