Photo-curable and thermo-curable resin composition and dry film solder resist

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United States of America Patent

PATENT NO 9880467
SERIAL NO

14419179

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Abstract

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The present invention relates to a photo-curable and thermo-curable resin composition which can form a DFSR having micro unevenness on the surface without a separate treatment such as plasma treatment and the like and a DFSR. The photo-curable and thermo-curable resin composition includes an acid-modified oligomer having a carboxyl group (—COOH) and a photo-curable unsaturated functional group; a polyimide-based resin; a photo-polymerizable monomer having two or more photo-curable unsaturated functional groups; a thermo-curable binder having a thermo-curable functional group; and a photoinitiator.

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Patent Owner(s)

  • LG CHEM, LTD.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Choi, Bo Yun Daejeon, KR 8 16
Choi, Byung Ju Daejeon, KR 10 13
Jeong, Min Su Daejeon, KR 10 15
Jeong, Woo Jae Daejeon, KR 13 15
Lee, Kwang Joo Daejeon, KR 50 56

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