SYSTEM AMD METHOD FOR SUBSTRATE HOLDING
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United States of America Patent
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Issued Date -
Jul 23, 2015
app pub date -
Jan 15, 2015
filing date -
Jan 20, 2014
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Abstract
A system for mechanically holding a substrate during processing includes a closeable processing chamber and an upper block assembly located inside the processing chamber and configured to hold a wafer via three mechanical holding assemblies. The three mechanical holding assemblies protrude above a cover of the wafer processing chamber and are configured to hold the wafer at an edge of the wafer and to be adjusted from outside of the processing chamber. Two of the mechanical holding assemblies are lockable in position relative to the wafer edge and one of the mechanical holding assemblies is configured to maintain a hold preload on the wafer edge via a preload mechanism.
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