Semiconductor TSV device package to which other semiconductor device package can be later attached
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United States of America Patent
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Aug 1, 2017
Grant Date -
Jul 23, 2015
app pub date -
Jan 21, 2014
filing date -
Jan 21, 2014
priority date (Note) -
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Abstract
A first package includes a laminate layer, an overmold layer above and in direct contact with the laminate layer, and a logic circuit-through-silicon via (TSV) layer including a first logic die and TSVs. The logic circuit-TSV layer is within the overmold layer, and the TSVs are electrically exposed at a top surface of the overmold layer. The first package may be fabricated and tested by a first party prior to being provided to a second party. A second package includes a second logic die. The second party may attach the second package to the first package at the electrically exposed TSVs of the first package to realize a complete and functional semiconductor device.
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