Importance

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Abstract

According to one embodiment, in semiconductor device, first semiconductor region is provided between first electrode and second electrode. Second semiconductor region is provided between first semiconductor region and second electrode. Third semiconductor region is provided between second semiconductor region and second electrode. Third electrode is in contact with first semiconductor region, second semiconductor region, and third semiconductor region via insulating film. Element part is configured to detect heat released from at least one of first semiconductor region, second semiconductor region, and third semiconductor region. Fourth semiconductor region is provided between first semiconductor region and second electrode. Fifth semiconductor region is provided between fourth semiconductor region and second electrode. And fourth electrode is in contact with first semiconductor region, fourth semiconductor region, and fifth semiconductor region via insulating film.

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First Claim