Device including interposer between semiconductor and substrate

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9686864
SERIAL NO

14417821

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

A device including a semiconductor, a substrate, and an interposer. The interposer is attached between the semiconductor and the substrate to absorb stresses between the semiconductor and the substrate.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

  • HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Bernard, Sheldon A Corvallis, US 1 6
Choy, Silam J Corvallis, US 40 186
Walmsley, Robert G Palo Alto, US 39 611
Wu, Jennifer Corvallis, US 39 477
Zhang, Zhuqing Corvallis, US 14 19

Cited Art Landscape

Load Citation

Patent Citation Ranking

Forward Cite Landscape

Load Citation

Maintenance Fees

Fee Large entity fee small entity fee micro entity fee due date
7.5 Year Payment $3600.00 $1800.00 $900.00 Dec 20, 2024
11.5 Year Payment $7400.00 $3700.00 $1850.00 Dec 20, 2028
Fee Large entity fee small entity fee micro entity fee
Surcharge - 7.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge - 11.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge after expiration - Late payment is unavoidable $700.00 $350.00 $175.00
Surcharge after expiration - Late payment is unintentional $1,640.00 $820.00 $410.00