SEMICONDUCTOR STRUCTURE
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United States of America Patent
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N/A
Issued Date -
Jul 30, 2015
app pub date -
May 28, 2014
filing date -
Jan 28, 2014
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A semiconductor structure comprising a tray, a chip, a first grounding wire and a second grounding wire is provided. The tray has a first surface and a second surface, and there is a height difference existing between the first surface and the second surface. The chip is disposed on the first surface of the tray and has an active surface. The first grounding wire connects the active surface and the second surface. The second grounding wire connects the first surface and the second surface.
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