LIGHT EMITTING DIODE PACKAGE STRUCTURE AND METHOD THEREOF
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Jul 30, 2015
app pub date -
Jun 3, 2014
filing date -
Jan 28, 2014
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A light emitting diode (LED) package structure is provided. The LED package structure comprises a substrate, at least one LED chip, an encapsulating compound and a curing material. The substrate has a first surface and a second surface opposite to the first surface. The LED chip is disposed on the first surface. The encapsulating compound covers the LED chip. The encapsulating compound has a plurality of particulate phosphors therein. The phosphors are centralized near a side of the encapsulating compound away from the substrate. The curing material is adhered to the side of the encapsulating compound away from the substrate.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully