WORKPIECE CUTTING METHOD
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United States of America Patent
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N/A
Issued Date -
N/A
app pub date -
Aug 1, 2013
filing date -
Aug 22, 2012
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
The object cutting method comprises a step of locating a converging point of laser light within a monocrystal sapphire substrate, while using a rear face of the monocrystal sapphire substrate as an entrance surface of the laser light, and relatively moving the converging point along each of a plurality of lines to cut set parallel to the m-plane and rear face of the substrate, so as to form a modified region within the substrate along each line and cause a fracture to reach a front face. In this step, t−[(d/2)−m]/tan α
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