POLISHING COMPOSITION

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United States of America Patent

APP PUB NO 20150218709A1
SERIAL NO

14426124

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Abstract

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To provide a means by which polishing rate can further be improved in a polishing composition to be used for an application of polishing an object to be polished containing a metal element or a semimetal element. Oxo acid containing a metal element or a semimetal element, and water are contained in a polishing composition to be used for an application of polishing an object to be polished containing a metal element or a semimetal element.

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Patent Owner(s)

Patent OwnerAddress
FUJIMI INCORPORATEDKIYOSU-SHI AICHI 452-8502

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Yoshizaki, Yukinobu Kiyosu-shi, JP 28 75

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