Heat Dissipation Device
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United States of America Patent
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Issued Date -
Aug 6, 2015
app pub date -
Jan 31, 2014
filing date -
Jan 31, 2014
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Abstract
A heat dissipation device includes a main body and a radiation heat dissipation layer. The main body has a first board body and a second board body. The first and second board bodies are correspondingly mated with each other to define a receiving space. At least one capillary structure and a working fluid are disposed in the receiving space. The radiation heat dissipation layer is formed on one face of the second board body, which face is distal from the first board body. The heat dissipation device is disposed in a mobile device to provide a very good heat dissipation effect for the closed space of the mobile device by way of natural convection and radiation. Therefore, the heat dissipation performance of the entire mobile device is greatly enhanced.
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