Heat Dissipation Structure for Semiconductor Element
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United States of America Patent
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Issued Date -
Aug 6, 2015
app pub date -
Jan 31, 2014
filing date -
Jan 31, 2014
priority date (Note) -
Abandoned
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Abstract
A heat dissipation structure for semiconductor element includes a semiconductor element and a covering. The covering has a first side and an opposite second side and is formed on the second side with a heat radiation layer. The covering is externally covered on one side of the semiconductor element with the first side of the covering attached to the covered side of the semiconductor. By attaching the covering to one side of the semiconductor element, heat emitted by the semiconductor element during operation can be more quickly absorbed by the covering and radiated from the heat radiation layer into ambient environment to avoid heat accumulation on the semiconductor element.
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