Microbump and sacrificial pad pattern
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United States of America Patent
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May 24, 2016
Grant Date -
Aug 6, 2015
app pub date -
Dec 8, 2014
filing date -
Dec 28, 2012
priority date (Note) -
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Abstract
Embodiments described herein generally relate to connections for integrated circuit (IC) dies. For example, in an embodiment an integrated circuit (IC) die is provided. The IC die includes a plurality of clusters of pads formed on a surface of the IC die, each cluster being associated with a respective circuit formed in the IC die. Each cluster includes a plurality of micropads each electrically coupled to the circuit associated with the cluster through a respective via and a sacrificial pad coupled to the circuit through the plurality of micropads, the sacrificial pad being larger than each of the micropads.
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