Methods of forming ultra thin package structures including low temperature solder and structures formed therby
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Oct 4, 2016
Grant Date -
Aug 6, 2015
app pub date -
Apr 14, 2015
filing date -
Dec 20, 2012
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods and structures may include attaching a device to a patch substrate, wherein the assembled device and patch substrate comprise a warpage, attaching the assembled device and patch substrate to an interposer to form a package structure, and then reflowing the package structure at a temperature below about 200 degrees Celsius to form a substantially flat package structure.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully