Conduction structure, method of manufacturing conduction structure, droplet ejecting head, and printing apparatus
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United States of America Patent
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Nov 21, 2017
Grant Date -
Aug 13, 2015
app pub date -
Feb 6, 2015
filing date -
Feb 10, 2014
priority date (Note) -
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Abstract
A conduction structure includes a device substrate (third substrate) including a conductive portion, an IC (second substrate) including an upper surface, an end surface inclined toward the upper surface, and a conductive portion (second conductive portion), a sealing plate (first substrate) including an upper surface, an end surface (first side wall portion) inclined toward the upper surface, and a conductive portion (first conductive portion), and plating layers that respectively form electrical connections between a conductive portion and a conductive portion and between a conductive portion and the conductive portion.
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