PLASMA TREATMENT APPARATUS AND METHOD

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United States of America Patent

SERIAL NO

14691776

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Abstract

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A substrate held by a holder is housed in a treatment chamber. An electrode set is disposed so as to face a surface of the substrate. Each electrode set consists of a first electrode section and a second electrode section. Each of the first and second electrode sections consists of high-frequency electrodes and/or ground electrodes. Process gas emitted through introduction ports is fed between the electrodes to generate plasma. The generated plasma is used to remove contaminated substances adhered to the surface of the substrate.

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Patent Owner(s)

Patent OwnerAddress
JCU CORPORATIONTOKYO 1100015

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Asano, Keisuke Kawasaki-shi, JP 15 36
FUKAZAWA, Shinji Kawasaki-shi, JP 2 27
Ueyama, Hiroyuki Kawasaki-shi, JP 36 647

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