PROCESSING ARRANGEMENT WITH TEMPERATURE CONDITIONING ARRANGEMENT AND METHOD OF PROCESSING A SUBSTRATE
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Aug 22, 2013
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Aug 27, 2012
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Abstract
A substrate processing arrangement exhibits a thermal cavity with two reflective surfaces and a carbon heater for effectively heating substrates to temperatures of 750° C. and more. It has been shown, that even substrates with low absorption properties in the infrared part of the spectrum (glas, silicon, sapphire) can be effectively heated by “sandwiching” a substrate and a heating element between two reflective surfaces, which can be established by a mirror and the target of a PVD source.
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