MILLIMETER WAVE BANDS SEMICONDUCTOR PACKAGE AND MILLIMETER WAVE BANDS SEMICONDUCTOR DEVICE
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United States of America Patent
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N/A
Issued Date -
Aug 13, 2015
app pub date -
Jul 18, 2014
filing date -
Feb 7, 2014
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
Certain embodiments provide a millimeter wave bands semiconductor package including a first metal block, a second metal block, and a circuit board. The first metal block includes a first penetration hole and a second penetration hole, each of which has a flattening film on an inner surface thereof. The second metal block includes a first non-penetration hole and a second non-penetration hole, each of which has a flattening film on an inner surface thereof. The circuit board is disposed between the first metal block and the second metal block and has an input signal line and an output signal line on a front side surface thereof. The first metal block and the second metal block are disposed such that the first non-penetration hole and the first penetration hole constitute a first waveguide and the second non-penetration hole and the second penetration hole constitute a second waveguide.
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