Housing for an Optical Component, Assembly, Method for Producing a Housing and Method for Producing an Assembly
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United States of America Patent
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Issued Date -
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app pub date -
Aug 28, 2013
filing date -
Sep 5, 2012
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A housing for an optical component is provided in various embodiments. The housing has a leadframe section and a mold compound. The leadframe section is formed from an electrically conductive material and has a first side and a second side facing away from the first side. On the first side, the leadframe section has at least one first receiving region for receiving the optical component and/or at least one contact region for electrically contacting the optical component. The leadframe section has at least one trench which is formed in the leadframe section on the first side thereof alongside the receiving region and/or the contact region. The leadframe section is embedded in the mold compound. The mold compound has at least one receiving recess in which the first receiving region and/or the contact region and the trench are arranged.
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