Board assembly for transmitting high-speed signal and method of manufacturing the same
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Dec 27, 2016
Grant Date -
Aug 13, 2015
app pub date -
Feb 11, 2015
filing date -
Feb 12, 2014
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A board assembly for transmitting a high-speed signal and a method of manufacturing the same. The board assembly may include a submount board, a base board, and a contact member for a signal line. The submount board may include at least one first high-speed signal line formed on the surface thereof. The base board may include the submount board on one part of the upper surface thereof, and at least second high-speed signal line on the other part of the upper surface thereof, wherein the second high-speed signal lines corresponds to the first high-speed signal lines, respectively. The contact member for the signal line may be installed on the side of the submount board, and have an upper portion contacting the first high-speed signal line and a lower portion contacting the second high-speed signal line such that the first high-speed signal line contacts the second high-speed signal line.
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully