POLISHING COMPOSITION
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United States of America Patent
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Issued Date -
Aug 20, 2015
app pub date -
Aug 23, 2013
filing date -
Sep 14, 2012
priority date (Note) -
Abandoned
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Abstract
To provide a polishing composition, in which a high polishing rate for a barrier layer and an insulation film can sufficiently be maintained, a polishing rate of a low dielectric material can sufficiently be suppressed, and aggregation of abrasive grains can be prevented. The invention is a polishing composition to be used for an application of polishing a polishing object having a barrier layer, a metal wiring layer, and an insulation film, comprising an oxidizing agent, and a nonionic compound having a weight average molecular weight of 1,000 or less.
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