Hybrid-Filled Epoxy Molding Compositions
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United States of America Patent
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Issued Date -
Aug 20, 2015
app pub date -
Feb 14, 2014
filing date -
Feb 14, 2014
priority date (Note) -
Abandoned
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Abstract
A hybrid-filled, electrically insulating composition includes a resinous matrix comprising 56 to 65 volume percent of the total composition and a particulate dispersed phase comprising essentially the balance of the total composition. The dispersed phase includes a first ceramic component such as AlN, BN, or BeO and a second ceramic component such as MgO, Al2O3, SiO2, a polycrystalline alumino-silicate, and/or a metal. The dispersed phase makes up more than 50 volume percent of the first component. The molding composition has a thermal conductivity of at least 3.5 W/mK.
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