Thermal metal ground for integrated circuit resistors

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United States of America Patent

PATENT NO 9930769
SERIAL NO

14181187

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Abstract

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Metal thermal grounds are used for dissipating heat from integrated-circuit resistors. The resistors may be formed using a front end of line layer, for example, a titanium-nitride layer. A metal region (e.g., in a first metal layer) is located over the resistors to form a heat sink. An area of thermal posts connected to the metal region is also located over the resistor. The metal region can be connected to the substrate of the integrated circuit to provide a low impedance thermal path out of the integrated circuit.

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Patent Owner(s)

Patent OwnerAddress
QUALCOMM INCORPORATED5775 MOREHOUSE DRIVE SAN DIEGO CA 92121-1714

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Drennan, Patrick Gilbert, US 2 5
Loke, Alvin Leng Sun San Diego, US 33 308
Mittal, Arpit San Diego, US 27 472
Saeidi, Mehdi San Diego, US 36 268

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