Z-connection for a microelectronic package using electroless plating
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United States of America Patent
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Sep 13, 2016
Grant Date -
Aug 27, 2015
app pub date -
May 11, 2015
filing date -
Nov 13, 2012
priority date (Note) -
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status (Latency Note)
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Abstract
An assembly includes a substrate having a substrate conductor and a contact at a first surface and a terminal at a second surface for electrically interconnecting the assembly with a component external to the assembly, at least one of the substrate conductor or the contact electrically coupled with the terminal. A first element has a first surface facing the first surface of the substrate, a first conductor at the first surface and a second conductor at a second surface. An interconnect structure may extend through the first element electrically coupling the first and second conductors. An adhesive layer may bond first surfaces of the first element and the substrate, and at least portions of the first conductor and the substrate conductor may be beyond an edge of the adhesive layer. A continuous electroless plated metal region may extend between the first conductor and the substrate conductor.
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