Method of Manufacturing Thermoelectric Device and Thermoelectric Cooling Module and Device Using the Same
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United States of America Patent
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Sep 3, 2015
app pub date -
Dec 17, 2012
filing date -
Dec 21, 2011
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Provided is a method of manufacturing a thermoelectric device, including: forming a base substrate formed of a main raw material composed of Bi2(SeXTe1-X)3; milling the base substrate; changing a combination composition of any one material selected from Bi, Se and Te in the base substrate; adding and mixing one or more materials selected from Ag, Au, Pt, Cu, Ni, and Al to and with the base substrate and milling them; and forming a thermoelectric semiconductor device by sintering the milled materials.
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