EXPANDABLE COMPOSITION IN THE FORM OF A GRANULAR MATERIAL

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United States of America Patent

APP PUB NO 20150252165A1
SERIAL NO

14434925

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Abstract

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The present invention relates to expandable compositions in the form of granular materials that are based on epoxy resins with a content of binders and curing agents for curing the epoxy resin. Corresponding compositions can be readily introduced into hollow bodies, for example, into sticks or roof supports and expanded to a foam by heating the composition and cured. This results in hollow bodies filled with foam that are distinguished by significantly improved mechanical properties compared to comparable hollow bodies without a foam filling. At the same time, the granular materials according to the invention can be very readily processed without a complex and expensive two-component injection-molding process being necessary.

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Patent Owner(s)

Patent OwnerAddress
SIKA TECHNOLOGY AGZUGERSTRASSE 50 BAAR CH-6340

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Bordeanu, Nicolae Winterthur, CH 7 3
Frick, Karsten Remetschwil, CH 22 178
Hoefflin, Frank Baden, CH 26 88

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