HIGH THERMAL CONDUCTIVITY RESIN COMPOSITION
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United States of America Patent
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Issued Date -
Sep 10, 2015
app pub date -
Feb 24, 2015
filing date -
Mar 7, 2014
priority date (Note) -
Abandoned
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Abstract
Provided is a thermoplastic resin composition having excellent thermal conductivity and high electrical insulating properties, and having excellent flexibility in comparison to ceramic molded bodies and thermoset resin compositions. The resin composition contains 20-60 volume percent of thermoplastic resin and 40-80 volume percent of boron nitride. The boron nitride is made up of spherical boron nitride particles and flat boron nitride particles. The spherical boron nitride particles have average particle size of 50-300 μm and aspect ratio or 1-2. The flat boron nitride particles have average particle size of 8-100 μm and aspect ratio of 30-300. The volume ratio of the spherical boron nitride particles with respect to the total amount of boron nitride is 75 vol %-99 vol %. Further provided are melt molded products of this thermoplastic resin composition and a method for the manufacture of such melt molded products.
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