Importance

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Abstract

In accordance with an embodiment, a design method includes classifying interconnection line patterns each including a space between interconnection lines among design layout patterns of a semiconductor element with an air gap between the interconnection lines, on the basis of characteristics of the space, acquiring a basic amount of the classified interconnection line pattern, predicting a position where each air gap is highest and a height of the position for each classified interconnection line pattern, and suitably adjusting the arrangement of the interconnection lines in the design layout pattern in accordance with the predicted position and height. The basic amount is acquired from a shape of the classified interconnection line pattern. The position where each air gap is highest and the height of the position are predicted by collating data of a correlation between the width of the space and the height of the air gap with the basic amount.

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First Claim