Wafer-handling end effectors with wafer-contacting surfaces and sealing structures

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United States of America Patent

PATENT NO 9991152
SERIAL NO

14631131

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Abstract

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Wafer-handling end effectors and semiconductor manufacturing devices that include and/or are utilized with wafer-handling end effectors are disclosed herein. The end effectors include an end effector body and a plurality of wafer-contacting surfaces that is supported by the end effector body and configured to form an at least partially face-to-face contact with a wafer. The end effectors further include a vacuum distribution manifold that extends between a robot-proximal end of the end effector body and the plurality of wafer-contacting surfaces. The end effectors also include a plurality of vacuum openings that is defined within the plurality of wafer-contacting surfaces and extends between the plurality of wafer-contacting surfaces and the vacuum distribution manifold. The end effectors further include a plurality of sealing structures each of which is associated with a respective one of the plurality of wafer-contacting surfaces.

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Patent Owner(s)

  • CASCADE MICROTECH, INC.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Garrison, Ryan Beaverton, US 6 19
Ingram-Goble, Robbie Portland, US 7 229
Simmons, Michael E Colton, US 12 54
Storm, Christopher Hillsboro, US 3 4
Wolf, Philip Beaverton, US 11 30

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