Thermal vias disposed in a substrate without a liner layer

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United States of America Patent

PATENT NO 9299572
SERIAL NO

14201473

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Abstract

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An apparatus relating generally to a substrate is disclosed. In such an apparatus, the substrate has formed therein a plurality of vias. A liner layer is located on the substrate, including being located in a subset of the plurality of vias. At least one of the plurality of vias does not have the liner layer located therein. A thermally conductive material is disposed in the at least one of the plurality of vias to provide a thermal via structure.

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Patent Owner(s)

  • INVENSAS CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Gao, Guilian San Jose, US 126 2840

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