MICROELECTRONIC PACKAGE PLATE WITH EDGE RECESSES FOR IMPROVED ALIGNMENT
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Sep 10, 2015
app pub date -
Mar 5, 2014
filing date -
Mar 5, 2014
priority date (Note) -
Published
status (Latency Note)
Importance
Abstract
A microelectronic package includes a package substrate with at least one semiconductor die mounted thereon and a plate coupled to the package substrate. The plate is configured with a first recess formed in a first edge of the plate and a second recess formed in a second edge of the plate wherein the first edge and the second edge are formed on opposing sides of the plate. One advantage of the above-described embodiments is that a stiffener plate or heat spreader that is sized to cover most or all of the periphery of a package substrate can be coupled to the package substrate without causing alignment issues in subsequent fabrication processes.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully