COVER LAYER WITH HIGH THERMAL RESISTANCE AND HIGH REFLECTIVITY FOR A PRINTED CIRCUIT BOARD
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United States of America Patent
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N/A
Issued Date -
Sep 10, 2015
app pub date -
Mar 7, 2014
filing date -
Mar 7, 2014
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A cover layer of a printed circuit board has a polymer film, a reflective composite layer and an adhesive layer. The polymer film has a melting point greater than 260° C. The reflective composite layer is mounted on one side surface of the polymer film and has a first reflective pigment. The adhesive layer is mounted on another side surface of the polymer film. Also, at a range of wavelength where a reflectivity of the cover layer is greater than 89%, absorption of the polymer film to the same range of wavelength is less than 35%. The cover layer is laminated on a printed circuit board and after surface mount technology process at a temperature ranging from 160° C. to 320° C., the cover layer has a reflectivity over 89% without yellowing and delamination.
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