MEMS DEVICE AND METHOD FOR MANUFACTURING THE SAME

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United States of America Patent

APP PUB NO 20150259192A1
SERIAL NO

14469168

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Abstract

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According to one embodiment, a MEMS device is disclosed. The device includes a substrate, a MEMS element as a first component provided on the substrate, a first film having a plurality of through holes. The first film and the substrate are configured to form a cavity accommodating the MEMS element. The device further includes a second film provided on the first film, a second component provided on the substrate and disposed outside of the cavity, and a film provided on the substrate and disposed outside of the cavity, and configured to surround the second component.

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Patent Owner(s)

Patent OwnerAddress
KABUSHIKI KAISHA TOSHIBAMINATO-KU TOKYO 105-0023

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
HIRAYU, Tsuyoshi Yokohama-shi, JP 6 5
IGARASHI, Kiyonori Kitakami-shi, JP 2 0
SHIMOOKA, Yoshiaki Sagamihara-shi, JP 36 380
YAMAGUCHI, Hitomi Yokohama-shi, JP 13 59

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