Curable resin composition, production method of image sensor chip using the same, and image sensor chip

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United States of America Patent

PATENT NO 9657182
SERIAL NO

14725823

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Abstract

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There is provided a curable resin composition which is capable of being coated so as to have a film thickness of 20 μm or more and contains a dye having a maximum absorption wavelength in a wavelength range from 600 to 850 nm, and the infrared ray cut filter having a dye-containing layer having a film thickness of 20 μm or more formed from the curable resin composition, and a production method of image sensor chip comprising a step of coating the curable resin composition on a glass substrate to form a dye-containing layer, and a step of adhering the glass plate having the dye-containing layer formed on a solid-state imaging device substrate.

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Patent Owner(s)

  • FUJIFILM CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ezoe, Toshihide Shizuoka, JP 69 516
Nara, Yuki Shizuoka, JP 20 552
Shimada, Kazuto Shizuoka, JP 102 558

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