WAFER ETCHING SYSTEM AND WAFER ETCHING PROCESS USING THE SAME
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United States of America Patent
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Issued Date -
Sep 17, 2015
app pub date -
Jul 9, 2013
filing date -
Nov 30, 2012
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
Disclosed are a wafer etching system and a wafer etching process using same that enable thin wafers to be smoothly manufactured and transferred. The present invention includes: a wafer grinding device for mechanically etching wafers; an aligner for aligning etched wafers from the wafer grinding unit; a dry etching device for etching the wafers once more that are aligned by the aligner; a wafer transfer device for transferring the wafers between the aligner and the dry etching device; and a tape mounter for performing taping on the wafers that have completed etching from the dry etching device.
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