Semiconductor device manufacturing method and semiconductor device
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United States of America Patent
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Oct 6, 2015
Grant Date -
Sep 17, 2015
app pub date -
Sep 2, 2014
filing date -
Mar 14, 2014
priority date (Note) -
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Abstract
A semiconductor device manufacturing method includes forming grooves in a surface of a semiconductor substrate, stacking a plurality of semiconductor chips in each area of the semiconductor substrate surrounded by the grooves to form stacked bodies, forming a first sealing resin layer that covers spaces between the plurality of semiconductor chips and lateral sides of the stacked bodies, separating the semiconductor substrate to singulate the stacked bodies, mounting the stacked bodies on a wiring substrate, forming a second sealing resin layer that seals the stacked bodies on the wiring substrate, separating the wiring substrate to singulate a portion of the wiring substrate with a single stacked body thereon, and grinding a portion of the semiconductor substrate in a thickness direction from a side of the semiconductor substrate opposite to the stacked bodies, after forming the first sealing resin layer and before singulating the wiring substrate.
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