GROUNDING SYSTEM FOR COOLING OF ELECTRONIC DEVICES USING DIELECTRIC FLUIDS
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United States of America Patent
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Issued Date -
Sep 17, 2015
app pub date -
Mar 14, 2014
filing date -
Mar 14, 2014
priority date (Note) -
Abandoned
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Abstract
An apparatus comprising an integrated circuit. The integrated circuit comprises a substrate having a planar surface, a plurality of active electronic and/or optical devices located over the planar surface in the integrated circuit, and, a planar channel having a hollow interior and being located between the active electronic and/or optical devices, and the substrate. A portion of a segment of the planar channel is formed of metal or graphene.
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