Flexible package-to-socket interposer

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9570386
APP PUB NO 20150262916A1
SERIAL NO

14727776

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Abstract

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A flexible interposer for the attachment of a microelectronic package to a microelectronic socket, wherein a first portion of the flexible substrate may be positioned between the microelectronic package and the microelectronic socket, and a second portion of the flexible interposer may extend from between the microelectronic package and the microelectronic socket to electrically contact an external component. In one embodiment, the external component may be a microelectronic substrate and the microelectronic socket may be attached to the microelectronic substrate.

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Patent Owner(s)

  • INTEL CORPORATION

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Tran, Donald T Phoenix, US 29 194
Zhang, Zhichao Chandler, US 132 560

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